Sydek Hang Fung Precise Package (Shanghai) Co., Ltd. was found in April, 1999 by
Sydek Corporation, Hang Fung International Industrial Co., Ltd. and Iwatani
International Corporation. We provide high-quality industrial transport tray and
blister packaging for the consumer products.
The 21st century brings us a revolution of telecommunication. The exploding market of
communication and interconnectivity brings more business opportunities to component
suppliers and Shanghai is becoming more and more the electronic components
manufacturing center. As a result, main focus will be on how to deliver these
components safely and cost effectively to final assembly sites.
With years of experience in the thermoforming industry we are able to offer comprehensive
services to our customers. We cover all stages of a product life cycle:
the design, the development of prototypes, the manufacturing of the tooling and
the mass production. Our staff in Japan, Hong Kong and Shanghai is committed to
deliver the best services to you any times, any anywhere.
